我司是美國Bondline 在國內(nèi)唯一代理商，我司具備化學品零下45度從美國低溫孔空運的優(yōu)勢，目前合作的客戶有醫(yī)療電子，半導體等行業(yè)客戶，美國Bondline醫(yī)療級材料符合USP Class VI 認證。

美國Bondline 為半導體、醫(yī)療設備、微電子和航空航天行業(yè)的公司提供高質(zhì)量的環(huán)氧樹脂粘合劑。Bondline 生產(chǎn)解決復雜問題的尖端特種粘合劑材料。 1：醫(yī)用級膠粘劑 我們生產(chǎn)醫(yī)療級粘合劑，包括符合 USP VI 類標準的導管組件、無菌一次性用品、換能器組件、診斷設備、針頭組件、超聲波、光學透明其他醫(yī)療電子產(chǎn)品。 2：包裝膠 作為可靠和高性能薄膜和糊狀粘合劑、合規(guī)和低釋氣粘合劑、散熱（管理）粘合劑、芯片連接粘合劑、底部填充粘合劑、中介層粘合劑的制造商和供應商，粘合劑滿足 CSP 要求 3：電子級膠粘劑 我們生產(chǎn)電子級粘合劑，包括芯片貼裝、SMT、散熱器、底部填充、封裝等材料。

Bondline supplies high quality performance epoxy adhesives to companies in the semiconductor, medical device, microelectronic, and aerospace industries.Bondline manufactures cutting-edge specialty adhesive materials that solve complex problems.1：Medical Grade AdhesivesWe manufacture medical grade adhesives including USP Class VI compliant, catheter assembly, sterile disposables, transducer assembly, diagnostic equipment, needle assembly, ultrasound, optically clear other medical electronics.2：Packaging AdhesivesAdhesives meeting CSP requirements as a manufacturer and Supplier of Reliable and High Performance Film and Paste Adhesives, Compliant and Low Outgassing Adhesives, Thermal Dissipation (Management) Adhesives, Die Attach Adhesives, Underfill Adhesives, Interposer Adhesives3：Electronic Grade AdhesivesBondline